Producing Diligently、Serving Intimately、KYOJU
Process capability
Multilayer PCB
Accounting for nearly half of our market share, is our leading product, has an important influence on our factory. We have a reliable quality of the multilayer PCB supplier partners, to support this important share of products, from new products into mass production, direct docking and we plant related departments to establish a long-term firm relationship.
Number of layers
18layers
Maxmimum dimensions
20"*48"
PCB thickness
0.05mm-4.0mm
Copper weights (finished)
inner layer5oz，outer layer 8oz
Min Trace Width
3mil/0.05mm
Min Trace space
2mil/0.05mm
Min hole size
6mil/0.1mm
Min laser drilling
3mil/0.076mm
Holes tolerance
±3mil/±76um
Board thickness and holes size ratio
10：1
Impedance control
±5%
Surface finishes available
HASL [>1um] Immersion Tin [0.4-0.8um]
Plated tin [1-30um] , immersion gold [Ni,2-6um, Au,0.03-0.1um] ,
immersion silver (0.2-0.6um] . osp (0,1-0.6um]
gold fingers [Ni3-10um, Au,0.03-5.0um]
plated golden [Ni1-6um, Au003-0.1um]
ENEPIG [Ni,2-5um，Pd，0.01-0.1um]
Single-double layer board
Wide range of uses. With the growth of customers' demand for high-level digital circuit boards, this part of the share is decreasing, but in the automotive and industrial areas, there is still a big market, and the quality stability requirements are high.
Max layers
single-layer board ,double-layer board
Maximum page size
20"*48"
Board thickness
0.05mm-4.0mm
Board thickness
inner layer 5oz，outer layer 8oz
Min.Trace Width
2mil/0.05mm
Min.Trace space
2mil/0.05mm
Min. hole size
4mil/0.1mm
Minimum laser drilling aperture
3mil/0.076mm
Minimum hole copper thickness
0.4mil/10um
Aperture tolerance
±3mil/±76um
Board thickness to aperture ratio
10比1
Impedance control
±10%
Surface Treatmen
Spray tin > 1um
immersion tin 0.4-0.8um
Plated tin 1-30um
immersion gold (nickel thickness 2-6um ,gold thickness 0.03-0.4um)
immersion silver 0.2-0.6um
osp 0.1-0.6um
gold finger(nickel thickness 3-10um
gold thickness 0.03-0.1um)
Plated golden (nickel thickness 1-6um gold thickness 0.03-5.0um)
ENEPIG(nickel thickness 2-5um palladium thickness 0.01-0.1um)
High-density interconnect PCB
We have extensive experience in the production of HDI boards in different markets. Our factory has a comprehensive knowledge of the requirements and manufacturing methods of HDI products. Our technical team begins with the design phase of the HDI PCB, providing manufacturing teams with manufacturing technology and experience to improve manufacturing capacity and reduce overall product cost.
Number of layers
4 - 22layers standard , 30 layers senior
HDI
1+N+1, 2+N+2, 3+N+3,4+N+4，any layer R&D
board material
criterionFR4，High performanceFR4，No halogenFR4
finished copper thickness
18um-70um
Min Trace Width/space
0.075mm / 0.075mm
board thickness
0.40mm – 3.20mm
Maxmimum dimensions
610mm x 450mm
Surface finishes available
osp, immersion gold, Immersion Tin, immersion silver, Plated golden
Min mechanical drill
0.15mm
Min laser drilling
criterion 0.1mm, special treatment 0.075mm
Flex-rigid PCB
Flex-rigid composite board is a complex product which requires PCB suppliers to communicate with customers repeatedly. As with other complex products, we need early discussions with designers to optimize the design and cost of manufacturability.
Number of layers
4-16layers
Bending performance
Based on the specific design, the bend performance can range from a basic90 obend to fit to a full dynamic flex with 360° range of motion in the flextail that will withstand continuous cycles throughout the product life.
Bend features
Bend radius controls the flexibility of the flex portion of the board. Thethinner the material the lower the bend radius and the more flexible theflex section.
Copper weights (finished)
Hoz，1oz，2oz，3oz
Min Trace Width/space
0.075mm / 0.075mm
PCB thickness
0.4mm - 3mm
PCB thickness in flex section
0.05-0.8mm
Surface finishes available
ENIG, OSP Immersion tin, Immersion silver
Minimum mechanical drill
0.2mm
Flexible PCB
Today, the demand for flexible PCB in all industries is increasing, and demand for medical, military and industrial markets is particularly strong. As the demand for these markets is usually small, we work with a wide variety of small batch supplier partners to achieve rapid proofing and production for small quantities of flexible PCB.
Number of layers
polyimide(1-6layer),polyester(1-2layer)
Maxmimum dimensions
500mm*600mm
Min Trace Width
single layer board0.05mm，multilayer board 0.08mm
Min Trace space
single layer board0.05mm，multilayer board 0.08mm
Min hole size
0.25mm drill，0.5mm Punching
Dimensional tolerance
Wire width-W：
Holes-H：
Accumulated space-P：
outline size-L：
conductor to board edge-C：
±0.02mm，W<=0.05mm
±0.05mm，H<=1.5mm
±0.03mm，P<=25mm
±0.07mm，L<=50mm
±0.075mm，C<=5mm
Surface finishes available
Plated golden【0.02-3um】，immersion gold【0.025-0.075um】，
Plated tin【0.2-10um】，immersion tin【0.025-0.075um】，
Plated plumbum/tin【0.05-10um】，OSP【0.1-0.6um】，
HASL（Only suitable for Polyimide）
Insulated metal substrate PCB
Some of our factories are experts in this field, which focus on IMS products, automotive, medical, aerospace, lighting applications and industrial control industries. IMS PCB market share growth rapidly.
Number of layers
1-4layers
board material
Aluminium, copper board
Dielectric thickness
0.05mm – 0.20mm
Thermal conductivity
1-4 W/m/K
Copper weights (finished)
35um – 140um
Min Trace Width
0.1mm
Min Trace space
0.1mm
Min hole size
0.3mm
Metal core thickness
0.40mm – 3.20mm
Surface finishes available
HASL, LF HASL, OSP, ENIG, Imersion tin, Immsersion silver
Maxmimum dimensions
550mm x 700mm
Electronic component
We work with many well-known brands to provide our customers with the required components and solve all problems for our customers at one stop
JAE/航空电子
Connector
JCET/长电科技
Diode,transistor.MOSFET.LDO
LRC/乐山无线电
Integrated circuit, diode, triode, bridge rectifier
Manyue/万裕科技
Electrolytic capacitor
TE/泰科电子
Relay, contactor, switch
OMRON/欧姆龙
Microswitch，Limit switch，Pushbutton Switches，Dipswitch
Stencil,DIP Furnace vehicle
We design and manufacture various sizes of stencils and DIP furnace vehicles for our customers, covering the current mainstream types and materials.
Stencil
Manual stencil size
37*47cm，42*52cm，40*60cm
Automatic stencil size
55*65cm，58*58cm，73.6*73.6cm
Stepped stencil
Make according to customer's actual requirement
stencil thickness
0.08mm，0.1mm，0.12mm，0.15mm，0.18mm，0.2mm
DIP Furnace vehicle
material quality
Synthetic stone（thermostability），glass fibre，Bakelite
Multilayer PCB
Accounting for nearly half of our market share, is our leading product, has an important influence on our factory. We have a reliable quality of the multilayer PCB supplier partners, to support this important share of products, from new products into mass production, direct docking and we plant related departments to establish a long-term firm relationship.
Number of layers
Min laser drilling
Number of layers
20"*48"
PCB thickness
0.05mm-4.0mm
PCB thickness
Min laser drilling
Min Trace Width
3mil/0.05mm
Min Trace space
2mil/0.05mm
Min Trace space
6mil/0.1mm
Min laser drilling
3mil/0.076mm
Min laser drilling
±3mil/±76um
Min laser drilling
10:1
Min laser drilling
±5%
Min laser drilling
HASL [>1um] Immersion Tin [0.4-0.8um]
Plated tin [1-30um] , immersion gold [Ni,2-6um, Au,0.03-0.1um] ,
immersion silver (0.2-0.6um] . osp (0,1-0.6um]
gold fingers [Ni3-10um, Au,0.03-5.0um]
plated golden [Ni1-6um, Au003-0.1um]
ENEPIG [Ni,2-5um，Pd，0.01-0.1um]
Single-double layer board
Wide range of uses. With the growth of customers' demand for high-level digital circuit boards, this part of the share is decreasing, but in the automotive and industrial areas, there is still a big market, and the quality stability requirements are high
Number of layers
single-layer board ,double-layer board
Maxmimum dimensions
20"*48"
PCB thickness
0.05mm-4.0mm
Maximum copper thickness
inner layer 5oz，outer layer 8oz
Min Trace Width
2mil/0.05mm
Min Trace space
2mil/0.05mm
Min hole size
4mil/0.1mm
Min laser drilling
3mil/0.076mm
Copper in holes
0.4mil/10um
Holes tolerance
±3mil/±76um
Board thickness and holes size ratio
10:1
Impedance control
±10%
Surface finishes available
HASL [>1um] , Immersion Tin [0.4-0.8um] plated tin [1-30um] ,
immersion gold [Ni2-6um, Au,0.03-0.1um] ,
immersion silver [0.2-0.6um] . osp [0.1-0.6um]
gold fingers (Ni,3-10um, Au,0.03-5.0um]
Plated golden [Ni,1-6um, Au,0.03-0.1um]
ENEPIG [Ni,2-5um，Pd，0.01-0.1um]
High-density interconnect PCB
We have extensive experience in the production of HDI boards in different markets. Our factory has a comprehensive knowledge of the requirements and manufacturing methods of HDI products. Our technical team begins with the design phase of the HDI PCB, providing manufacturing teams with manufacturing technology and experience to improve manufacturing capacity and reduce overall product cost.
Number of layers
4 - 22layers standard , 30 layers senior
HDI
1+N+1, 2+N+2, 3+N+3,4+N+4，any layer R&D
board material
criterionFR4，High performanceFR4，No halogenFR4
finished copper thickness
18um-70um
Min Trace Width/space
0.075mm / 0.075mm
board thickness
0.40mm – 3.20mm
Maxmimum dimensions
610mm x 450mm
Surface finishes available
osp, immersion gold, Immersion Tin, immersion silver, Plated golden
Min mechanical drill
0.15mm
Min mechanical drill
criterion 0.1mm, special treatment 0.075mm
Flex-rigid PCB
Flex-rigid composite board is a complex product which requires PCB suppliers to communicate with customers repeatedly. As with other complex products, we need early discussions with designers to optimize the design and cost of manufacturability.
Number of layers
4-16layers
Bending performance
Based on the specific design, the bend performance can range from a basic90 obend to fit to a full dynamic flex with 360° range of motion in the flextail that will withstand continuous cycles throughout the product life.
Bend features
Bend radius controls the flexibility of the flex portion of the board. Thethinner the material the lower the bend radius and the more flexible theflex section.
Copper weights (finished)
Hoz，1oz，2oz，3oz
Min Trace Width/space
0.075mm / 0.075mm
PCB thickness
0.4mm - 3mm
PCB thickness in flex section
0.05-0.8mm
Surface finishes available
ENIG, OSP Immersion tin, Immersion silver
Minimum mechanical drill
0.2mm
Flexible PCB
Today, the demand for flexible PCB in all industries is increasing, and demand for medical, military and industrial markets is particularly strong. As the demand for these markets is usually small, we work with a wide variety of small batch supplier partners to achieve rapid proofing and production for small quantities of flexible PCB.
Number of layers
polyimide(1-6layer),polyester(1-2layer)
Maxmimum dimensions
500mm*600mm
Min Trace Width
single layer board0.05mm，multilayer board 0.08mm
Min Trace space
single layer board0.05mm，multilayer board 0.08mm
Min hole size
0.25mm drill，0.5mm Punching
Dimensional tolerance
Wire width-W：
Holes-H：
Accumulated space-P：
outline size-L：
conductor to board edge-C：
±0.02mm，W<=0.05mm
±0.05mm，H<=1.5mm
±0.03mm，P<=25mm
±0.07mm，L<=50mm
±0.075mm，C<=5mm
Surface finishes available
Plated golden【0.02-3um】，immersion gold【0.025-0.075um】，
Plated tin【0.2-10um】，immersion tin【0.025-0.075um】，
Plated plumbum/tin【0.05-10um】，OSP【0.1-0.6um】，
HASL（Only suitable for Polyimide）
Insulated metal substrate PCB
Some of our factories are experts in this field, which focus on IMS products, automotive, medical, aerospace, lighting applications and industrial control industries. IMS PCB market share growth rapidly.
Number of layers
1-4layers
board material
Aluminium, copper board
Dielectric thickness
0.05mm – 0.20mm
Thermal conductivity
1-4 W/m/K
Copper weights (finished)
35um – 140um
Min Trace Width
0.1mm
Min Trace space
0.1mm
Min hole size
0.3mm
Metal core thickness
0.40mm – 3.20mm
Surface finishes available
HASL, LF HASL, OSP, ENIG, Imersion tin, Immsersion silver
Surface finishes available
550mm x 700mm
Electronic component
We work with many well-known brands to provide our customers with the required components and solve all problems for our customers at one stop.
JAE/航空电子
Connector
JCET/长电科技
Diode,transistor.MOSFET.LDO
LRC/乐山无线电
Integrated circuit, diode, triode, bridge rectifier
Manyue/万裕科技
Electrolytic capacitor
TE/泰科电子
Relay, contactor, switch
OMRON/欧姆龙
Microswitch，Limit switch，Pushbutton Switches，Dipswitch
Stencil,DIP Furnace vehicle
We design and manufacture various sizes of stencils and DIP furnace vehicles for our customers, covering the current mainstream types and materials.
Stencil
Manual stencil size
37*47cm，42*52cm，40*60cm
Automatic stencil size
55*65cm，58*58cm，73.6*73.6cm
Stepped stencil
Make according to customer's actual requirement
stencil thickness
0.08mm，0.1mm，0.12mm，0.15mm，0.18mm，0.2mm
DIP Furnace vehicle
material quality
Synthetic stone（thermostability），glass fibre，Bakelite
Producing Diligently、Serving Intimately、KYOJU
Products
Red Soldermask Gold fingers
24-layer Embedded-Capacitance PCB
2-step HDI Golden finger board
12-layer flex-rigid board
18-layer flex-rigid board
3F1R flex-rigid board
20-layer back panel
32-layer back panel
Red Soldermask back panel
32-layer Multilayer board
Tel：
Add：
Room 317,Block A, Taihua building, Haitian road 13,Free trade zone,Dalian,Liaoning